Wafer dicing is one of the techniques common in the semiconductor industry. It is really a method of splitting up a die from a wafer of semiconductor and this is accomplished using many practices like scribing and breaking, by mechanical sawing, or by laser cutting. Applying wafer dicing equipment, wafers are cut into individual semiconductor chips, with assistance from dicing blades.

'Wafer dicing methods'

Scribing and breaking - generally is performed in a substrate made of a brittle material where good-quality cutting floor of the substrate may be achieved without the defects such as for instance chippings on the substrate. This technique of semiconductor wafer divorce is accomplished by developing a stress in the wafer and then fracturing the wafer along the worries line. A point should be produced in the wafer floor along the street where in actuality the break is desired.

Technical sawing - the process is completed utilizing a technical machine named dicing found; this process is useful for a micro electro-mechanical system semiconductor devices. While you will find however suppliers that use this approach, it is gradually finding unpopular due to a few shortcomings - the procedure is gradual, contaminant-laden, and dependent on standard shapes.

Laser chopping - a brand new and far better engineering to cut semiconductor resources; the process functions by directing the production of a high-power laser at the product to be cut. This method burns up or vaporizes out the undesirable elements, making a benefit with a top quality area finish.

'Dicing blades'

As previously mentioned above, dicing knives are employed and are a significant factor for the dicing process. There are numerous forms of dicing blades and a number of them are these:

Hubbed Nickel Bonded Blades - this is used to reduce Silicon and III-V materials. That blade is ultra-thin and developed employing a specific electrodepositing method to carry the chopping diamonds in a nickel alloy matrix.

Hubbed Resin Bonded Knives - with this type of knife, there's no need to buy high priced flanges as the resinoid edge is forever secured to its own hub. Rather than flanges, after the blade is dressed, it can be indifferent and reattached again without going right through the dressing process.

Hubless Resin Bonden Blades - this type of dicing edge works well on components like porcelain, quartz, sapphire and glass. This will give minimum chipping and superior finish wooden dice box.

Steel Sintered Dicing Blades - this is a form of knife that has been created by capturing diamonds in a steel binder applying sintering process - this is a very rigid blade and has a suprisingly low wear rates. These attributes offer the ability to produce very right pieces even though afflicted by large exposures.