Changing trends in the semiconductor industry are likely to boost the growth pattern of the market in the years to come. For instance, the rising adoption of miniaturized electronics has led to the development of innovative semiconductors. This, in turn, is anticipated to facilitate innovations in the Semiconductor and IC Packaging Materials Market, thus, supporting its growth.

Segmentation:

The segments of the global Semiconductor and IC Packaging Materials Market based on type, identified in this report are organic substrates, encapsulation resins, bonding wires, ceramic packages, wafer level packaging dielectrics, solder balls, and others. Among these, the organic substrates segment is likely to hold the dominant share of the global market over the next couple of years. These materials form the base layer of semiconductors and support the addition of other layers. Thus, it is expected to witness substantial demand across the valuation period.

Regional Analysis:

The regional assessment of the global Semiconductor and IC Packaging Materials Market identified four key regions, viz. North America, Asia Pacific (APAC), Europe, and the Middle East & Africa (MEA). Asia Pacific is anticipated to lead the expansion of the global market over the next couple of years. Increasing demand from the electrical & electronics industry is anticipated to facilitate the growth of the Semiconductor and IC Packaging Materials Market in the nearby future. Rapid technological developments being adopted in the region is also prognosticated to open growth avenues for market players over the next couple of years.

Competitive Dashboard:

Henkel AG & Company, KGaA (Germany), Sumitomo Chemical Co., Ltd. (Japan), Hitachi Chemical Company, Ltd. (Japan), Kyocera Chemical Corporation (Japan), E. I. du Pont de Nemours and Company (U.S.), Toray Industries, Inc. (Japan), Mitsui High-tec, Inc. (Japan), Alent plc (U.K.).

Industry News:

In June 2019, Japan has imposed regulations controlling the export of the key semiconductor materials.

In August 2019, JSR Micro, an innovator in semiconductor materials solutions, has invested USD 100 Mn in the construction of a new semiconductor facility in Oregon, US. The new plant will be focusing on increasing the complexity of technology.