Custom Electronic Packaging Market 2020 - Overview and Analysis

Overview

The global Custom Electronic Packaging market is presumed to demonstrate 5% CAGR during the forecast period (2017-2023) owing to the boom in the e-Commerce retail industry, asserts Market Research Future (MRFR). Custom Electronic Packaging is referred to as fill materials generally used to identify, protect, prevent damage and tampering of electronic goods. Proper packaging of electronic goods is becoming essential with the growing competition in the electronics industry due to diversified product offerings and product differentiation.

With boom in the e-Commerce retail industry, the global Custom Electronic Packaging Market is considered to flourish. The rising competition in the electronics industry due to product differentiation and product offerings, proper packaging of electronic goods is becoming highly essential. Shipment of electronic goods across long distances is also augmenting the need for effective packaging solutions. Moreover, the need to protect the products is influencing the market growth across the globe. Also, the increasing production of several electronic devices is contributing to the growth of the market. Additionally, falling cost of packaging, concurrent rise in the demand for electronics packaging, and increasing global supply chains which results in long distance traveling are likely to influence market growth in the coming years. With the adoption of smart devices and increase in online shopping, the global market for Custom Electronic Packaging is estimated to flourish.

On the flip side, concern associated with environmental damage caused due to plastic waste and inflammable nature of packaging material are some of the major factors likely to hinder the market growth during the assessment period.

Segmental Analysis

The global Custom Electronic Packaging market has been segmented on the basis of material, product size, technology, and region.

By mode of material, the global Custom Electronic Packaging market has been segmented into foamed plastic, corrugated boxes, bubble packaging, paperboard, and others. Among these, the corrugated boxes account for the majority share in the market owing to the increasing preference for corrugated box packaging as they are light in weight, reusable, durable, and recyclable in nature.

By mode of product size, the global Custom Electronic Packaging market has been segmented into small and large appliances.

By mode of technology, the global Custom Electronic Packaging market has been segmented into track and trace packaging, and authentication packaging.

Regional Insights

Geographically, the Custom Electronic Packaging market span across regions, Europe, North America, Asia Pacific, and Rest-of-the-World.

Among all the regions, the Asia Pacific region is considered to dominate the global market and is likely to maintain its dominance. The growth is attributed to the growth of developing countries such as China and India. Moreover, the purchasing power among the people in this region is highly contributing to the market growth. Also, increasing consumption of electronics owing to the adoption of devices in the developing regions is further influencing the growth of the market. North America is led by the U.S. and is estimated to hold the second position due to their more extensive economy.

Competitive Dashboard

The prominent players operating the global Custom Electronic Packaging market are Dunapack Packaging (Austria), Mondi Plc. (Austria), Graham Packaging (U.S.), Pregis LLC (U.S.), International Paper Company (U.S.), Sealed Air Corporation (U.S.), Stora Enso (Finland), DS Smith Plc. (U.K.), Smurfit Kappa (Republic of Ireland), Sonoco Products Company (U.S.), Georgia-Pacific LLC (U.S.), and others.

  

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